Taipei · Taipei, Taiwan
面板級扇出型封裝創新論壇－異質整合國際高峰論壇系列活動
- Date
- Monday, August 31, 2026
- Time
- 13:00-17:00
About
SEMICON Taiwan paid innovation forum on panel-level fan-out packaging within the Heterogeneous Integration Global Summit series.
Tags
AImaker and tech communitymaker meetups